Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2008-02-20
2010-06-01
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S271100, C430S313000, C430S325000, C430S327000, C430S330000, C430S905000
Reexamination Certificate
active
07727705
ABSTRACT:
An etch resistant thermally curable Underlayer for use in a multiplayer liyhographic process to produce a photolithographic bilayer coated substrate, the composition having:(a) at least one cycloolefin polymer comprising at least one repeating unit of Structure (I), and at least one repeating unit of Structure (II), and optionally at least one repeating unit of Structure (III) with the proviso that neither Structure (I) nor Structure (II) nor Structure (III) contains acid sensitive groups.b) at least one cross-linking agent selected from the group consisting of an amino or phenolic cross-linking agent;c) a least one thermal acid generator (TAG);d) at lest one solvent; ande) optionally, at least one surfactant.
REFERENCES:
patent: 5488182 (1996-01-01), Kobayashi et al.
patent: 5854349 (1998-12-01), Abe et al.
patent: 6265506 (2001-07-01), Goodall et al.
patent: 6291131 (2001-09-01), Jung et al.
patent: 6323287 (2001-11-01), Foster et al.
patent: 6610808 (2003-08-01), De et al.
patent: 6800416 (2004-10-01), Kudo et al.
patent: 2002/0007018 (2002-01-01), Foster et al.
patent: 2002/0022196 (2002-02-01), Pavelchek et al.
patent: 2002/0052454 (2002-05-01), Lipian et al.
patent: 2002/0058204 (2002-05-01), Khojasteh et al.
patent: 2002/0128408 (2002-09-01), Goodall et al.
patent: 2003/0018153 (2003-01-01), Jayaraman et al.
patent: 2003/0180656 (2003-09-01), Matsuzawa
patent: 2004/0034155 (2004-02-01), Sugita et al.
patent: 2005/0215713 (2005-09-01), Hessell et al.
patent: 2005/0238997 (2005-10-01), De et al.
patent: 2005/0282091 (2005-12-01), Hatakeyama
International Search Report dated Sep. 15, 2008 to the corresponding National Patent Appl. PCT/US08/54528.
De Binod B.
Hong Chisun
Malik Sanjay
Sakamuri Raj
Fujifilm Electronic Materials U.S.A., Inc.
Lee Sin J.
Ohlandt Greeley Ruggiero & Perle L.L.P.
LandOfFree
High etch resistant underlayer compositions for multilayer... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High etch resistant underlayer compositions for multilayer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High etch resistant underlayer compositions for multilayer... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4157792