Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-08-16
2011-08-16
Nguyen, Thanh (Department: 2893)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S694000, C257SE21249
Reexamination Certificate
active
07998863
ABSTRACT:
A method of forming a contact structure and a contact structure so formed is described. The structure contacts an underlying layer of a semiconductor junction, wherein the junction comprises the underlying layer of a semiconductor material and is separated from an overlying layer of semiconductor material by creating an undercut region to shade subsequent metal formation. Various steps are performed using inkjet printing techniques.
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Kuepper Nicole Bianca
Mai Ly
Tjahjono Budi
Wenham Stuart Ross
Kowalski Thomas J.
Lunasin Heidi
Newsourth Innovations Pty Limited
Nguyen Thanh
Vedder Price PC
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