High efficiency metal lift-off process

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 1566591, 156664, 156668, 427 89, 427 96, 430315, B44C 122, C03C 1500, C03C 2506, B29C 3700

Patent

active

046629890

ABSTRACT:
An improved high efficiency metal lift-off process for removing a layer of metal at least partially covering a layer of photoresist. The method comprises forming microcracks located above the layer of photoresist in the layer of metal to be removed and providing solvent to the layer of photoresist through the microcracks.

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patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 4004044 (1977-01-01), Franco et al.
patent: 4064290 (1977-12-01), Ebel et al.
patent: 4119483 (1978-10-01), Hubsch et al.
IBM Technical Disclosure Bull., vol. 13, No. 9, Feb. 1971.
IBM Technical Disclosure Bull., vol. 20, No. 3, Aug. 1977.
IBM Technical Disclosure Bull., vol. 21, No. 8, Jan. 1979.

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