High-density split-gate FinFET

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S302000, C257S303000, C257S296000, C257S304000, C257S330000, C257S331000, C257S332000, C257S410000, C257S411000, C257S412000

Reexamination Certificate

active

06888199

ABSTRACT:
Disclosed is a method and structure for forming a split-gate fin-type field effect transistor (FinFET). The invention produces a split-gate fin-type field effect transistor (FinFET) that has parallel fin structures. Each of the fin structures has a source region at one end, a drain region at the other end, and a channel region in the middle portion. Back gate conductors are positioned between channel regions of alternating pairs of the fin structures and front gate conductors are positioned between channel regions of opposite alternating pairs of the fin structures. Thus, the back gate conductors and the front gate conductors are alternatively interdigitated between channel regions of the fin structures.

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patent: 6580124 (2003-06-01), Cleeves et al.
patent: 20020093053 (2002-07-01), Chan et al.
patent: 20020098657 (2002-07-01), Alavi et al.
patent: 20020105039 (2002-08-01), Hanafi et al.

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