High density ROM architecture

Details High density ROM architecture High density ROM architecture

2002-08-07

2003-11-04

Ho, Hoai (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S391000, C438S128000, C438S129000, C438S130000, C438S275000, C438S278000, C438S290000

Reexamination Certificate

active

06642587

ABSTRACT:

TECHNICAL FIELD
The present invention relates to the field of read only memory (ROM) cells, and ROM memory architecture providing for a high density and low power consumption.
BACKGROUND OF THE INVENTION
The present invention is directed to a ROM memory device. A ROM is a read only memory device which programmed during an integrated circuit manufacturing process. Once the ROM has been programmed the data in the ROM is fixed such that the data stored in the ROM can be read, but it cannot be changed.
FIG. 1
shows a ROM memory array architecture
100
of the prior art. This architecture includes an array
100
of bit cells, where each bit cell corresponds to an area between a bit line (BL
0
-BL
4
) and a word line (WL
0
-WL
3
). The ROM array
100
is programed with a combination of ones (1) and zeros (0). A zero (0) is stored in a bit cell of the ROM array
100
by providing an NMOS transistor between a bit line and a word line. For example, by virtue of the fact that a transistor T
10
is formed between the bit line BL
0
and word line WL
1
a 0 is stored in the corresponding bit cell. The word line acts as a gate for NMOS transistor T
10
and is electrically coupled to the channel region of the transistor through a dielectric layer such as silicon oxide. The drain of the NMOS transistor T
10
is coupled to the bit line BL
0
.
To sense whether a bit cell contains either a 0 or 1, a voltage is applied to the word line and if a transistor is coupled between the bit line and the word line at the bit cell being read, then current flows from the bit line through the transistor to ground. The detection of current through the NMOS transistor is achieved using a sense amplifier coupled to the bit line. Typically the presence of a transistor coupled between the word line and the bit line, which results in current flow being sensed on the bit line when a voltage is applied to the word line, corresponds to a 0 being stored in the bit cell.
A prior art diffusion ROM array
200
layout is shown in
FIG. 2
a
. The prior art diffusion array
200
shows an array which has not been programmed—or it could be viewed as a diffusion array where all of the bit cells are programmed such that there are no transistors coupling any of the bit lines to any of the word lines, and hence all of the bit cells are programmed such that they store a data bit of
1
. The operation of these ROMs is more clearly illustrated in connection with
FIG. 2
b
below.
The layout shown in
FIG. 2
b
shows a prior art diffusion ROM
201
where N+ diffusion has been used to program the ROM such that it corresponds to the architecture shown in FIG.
1
. The word lines (WL
0
-WL
3
) are typically formed of polysilicon. The contacts
202
which are present for each bit cell (see, Node
001
thru Node
423
where each node corresponds to two bit cells) are also typically formed of using a metal interconnect to the N+ node diffusion area. Each node has a first region
204
, which is a node diffusion region that is used to form a drain region. It should be noted that, as shown in
FIG. 2
a
, the node diffusion region
204
is present at each node regardless of whether a transistor has been formed to couple the bit line to a word line.
Each of the bit cells is coupled to one of the bit lines (BL
1
-BL
4
) by a contact
202
. Again it should be noted that, as shown in
FIG. 2
a
, the contact
202
coupling the bit line to a node diffusion region is present at each node regardless of whether a transistor has been formed to couple the bit line to a word line. The bit lines are typically formed of metal. The VSS (Gnd) lines are typically formed using N+ diffusion into the P type substrate
203
.
In the prior art diffusion ROM
201
(
FIG. 2
b
) an NMOS transistor can be formed at any of the nodes of the ROM by extending the N+ diffusion from the node diffusion area
204
through the contact
202
connected to the bit line. Specifically, as shown in
FIG. 2
b
the dotted lines
205
show regions where N+ diffusion into the underlying substrate forms NMOS transistors. The N+ diffusion extends the node diffusion region
204
to form a drain which is adjacent to the word line and further a source
206
is formed in the substrate by diffusing N+ into the substrate in the area between the word line and the Vss (gnd) area where N+ diffusion is also present. The word line acts as a gate, which is electrically coupled through a dielectric, with a channel region of the NMOS transistor.
FIG. 2
b
shows transistors formed between bit line BL
1
and word line WL
1
, and bit line BL
0
and word line WL
2
for example. It should be noted that the contact
202
and node diffusion area
204
can be used to create the NMOS transistors to adjacent word lines. For example, at node
401
, bit line (BL
4
), and the diffusion region is used to create bit line NMOS transistors to WL
0
and to WL
1
.
FIG. 2
c
shows a cross section of
FIG. 2
b
taken along Line A—A at the bit line BL
0
. It should be noted that
FIG. 2
c
is not to scale and is provided for generally illustrating the lay out of different elements of the ROM. In this case, the substrate
203
is a P type silicon substrate. Node
001
is shown having a node diffusion area
204
with N+ diffusion. This region
204
is present at each of the cells whether a transistor is coupled between the corresponding bit line and a word line. Areas
210
are shown adjacent to the node diffusion region
204
of node
001
, and adjacent to the node diffusion region
204
of node
023
. The regions
210
are areas of N+ diffusion; thus areas
210
in combination with areas
204
form a drain region for an NMOS transistor. Regions
212
are also areas with N+ diffusion. These regions
212
form sources for the NMOS transistors and these sources are coupled to Vss (gnd). The regions
213
form channels between the regions
210
and
212
. The channel region can conduct electrical current when a voltage is applied to the adjacent word line, and is not conductive when no voltage is present on the word line. The cross sectional view of
FIG. 2
c
shows transistors T
10
(coupling BL
0
to WL
1
) and T
20
(coupling BL
0
to WL
2
) as shown in FIG.
1
. The word lines WL
1
and WL
2
act as gates for the transistors, and are electrically coupled, via an intervening gate oxide dielectric material
215
with the channel regions
213
, such that when a voltage is applied to the word line the channel regions
213
become conductive, as discussed above.
FIG. 2
d
shows a cross section of
FIG. 2
b
taken along Line B—B, i.e. along bit line BL
3
. As shown in
FIG. 1
, and
FIGS. 2
b
and
2
d
no NMOS transistors are formed between the bit line BL
3
and any of the word lines WL
0
-WL
3
. Although no NMOS transistors are formed along bit line BL
3
, each bit line still has a node diffusion region
204
with N type diffusion and a contact
202
. Thus, the bit cell region
215
in the substrate
203
includes both the N type conductivity area of the node diffusion area
204
and the dielectric isolation region
209
.
As shown above, the prior art ROM bit cells require the presence of the node diffusion area
204
and a contact
202
, so that the ROM array can be programmed to achieve the desired connectivity which occurs when the diffusion node is extended during the programming of the ROM. For more advanced processes the node diffusion region
204
, which is sometimes referred to as an “island”, has a minimum area requirement specified by process design rules that are intended to ensure a high yield. This minimum area process rules will limit the minimum size of a ROM bit cell and limits the minimum area of the complete array of bit cells of the ROM. An example of this is shown in
FIG. 2
e
and
FIGS. 3
a-c
. Specifically, it can be seen that a minimum node diffusion area
207
has a significant effect on the overall size of the bit cells and the overall sized of the ROM.
FIGS. 3
a-c
illustrate that the minimum node diffusion area
207
can take on various aspect

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