Electric heating – Metal heating – By arc
Patent
1997-11-19
2000-02-22
Paschall, Mark
Electric heating
Metal heating
By arc
21912152, 2191214, 118723I, 156345, 31511121, B23K 1000, C23C 1600
Patent
active
060282851
ABSTRACT:
An apparatus for producing a plasma (70) within a vacuum chamber (50) comprising a high density plasma source (10) is disclosed wherein the source (10) comprises a top layer (13) and a bottom layer (11) electrically connected to and spaced apart from each other, in a manner to adjust the fields generated by the source (10), hence the uniformity of the plasma (70), wherein the top and bottom layers (13, 11) are formed by a plurality of conductive loops.
REFERENCES:
patent: 4948458 (1990-08-01), Ogle
patent: 5277751 (1994-01-01), Ogle
patent: 5280154 (1994-01-01), Cuomo et al.
patent: 5304279 (1994-04-01), Coultas et al.
patent: 5368710 (1994-11-01), Chen et al.
patent: 5401350 (1995-03-01), Patrick et al.
patent: 5405480 (1995-04-01), Benzing et al.
patent: 5436528 (1995-07-01), Paranjpe
patent: 5464476 (1995-11-01), Gibb et al.
patent: 5525159 (1996-06-01), Hama et al.
patent: 5529657 (1996-06-01), Ishii
patent: 5540800 (1996-07-01), Qian
patent: 5540824 (1996-07-01), Yin et al.
patent: 5558722 (1996-09-01), Okumura et al.
patent: 5571366 (1996-11-01), Ishii et al.
patent: 5578165 (1996-11-01), Patrick et al.
patent: 5589737 (1996-12-01), Barnes et al.
patent: 5619103 (1997-04-01), Tobin et al.
patent: 5650032 (1997-07-01), Keller et al.
patent: 5683548 (1997-11-01), Hartig et al.
patent: 5783102 (1998-07-01), Keller
patent: 5846375 (1998-12-01), Gilchrist et al.
Cherrington Blake E.
Khater Marwan H.
Overzet Lawrence J.
Board of Regents , The University of Texas System
Paschall Mark
Perez Daniel F.
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