High density pattern template: materials and processes for the a

Details High density pattern template: materials and processes for the a High density pattern template: materials and processes for the a

1993-09-08

1995-10-24

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430311, 430313, 430317, 430324, 430329, 430 30, 430945, 216 65, 216 66, 216 20, 216 83, G03C 500

Patent

active

054609216

ABSTRACT:
The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with non-halogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.

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