High density multichip module packaging structure

Details High density multichip module packaging structure High density multichip module packaging structure

1994-11-29

1996-10-29

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361803, 174260, 257724, H05K 111

Patent

active

055702740

ABSTRACT:
A multichip module packaging structure provided over a mother board. A multichip module substrate is mounted over the mother board through a frame member. The frame member is provided to extend successively on a peripheral region of a bottom surface of the substrate and further extend downward from the bottom surface of the substrate. The frame member also has a top portion bonded with the bottom surface of the substrate and a bottom portion bonded with the top surface of the mother substrate so as to form a three dimensional space surrounded by the frame member, the substrate and the mother board. A plurality of semiconductor integrated circuit chips are provided on the bottom surface of the substrate so that the chips are accommodated within the three dimensional space.

REFERENCES:
patent: 4742385 (1988-05-01), Kohmoto
patent: 4827082 (1989-05-01), Horiuchi et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
by Schroeder, Jon M., "Three-Dimensional Multichip Module Packaging", The International Journal of Microcircuits and Electronic Packaging, vol. 16, No. 2, Second Quarter 1993, pp. 117-123.

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