High density electronic circuits having very narrow conductors

Details High density electronic circuits having very narrow conductors High density electronic circuits having very narrow conductors

1983-08-15

1984-12-11

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361414, H05K 103

Patent

active

044879938

ABSTRACT:
Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.

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patent: 3040213 (1962-06-01), Byer et al.
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3445921 (1969-05-01), Leenhouts
patent: 3770529 (1973-11-01), Anderson
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3837074 (1974-09-01), Griff
patent: 3846166 (1974-11-01), Saiki et al.
patent: 4096626 (1978-06-01), Olsen et al.
patent: 4201616 (1980-05-01), Chellis et al.
Cocca et al., Laser Drilling of Bias in Dielectric High Density Multilayer Thick Film Circuits, Solid State Tech., Sep. 1978, pp. 62 to 66.
McIntosh et al., Packaging of Integrated Circuits, IBM Tech. Disc. Bull., vol. 15, #6, Nov. 1972, pp. 1979 to 1980.
Bakos et al., Preparation of Multilayer Modules Utilizing Glass Mixtures for Dielectric Insulator, vol. 18, #10, Mar. 1976, pp. 3180 and 3181.

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