Electrical connectors – Electromagnetic or electrostatic shield – Multi-part shield body
Reexamination Certificate
1999-04-21
2001-01-30
Nguyen, Khiem (Department: 2839)
Electrical connectors
Electromagnetic or electrostatic shield
Multi-part shield body
C439S660000
Reexamination Certificate
active
06179663
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to an electrical interconnection system for connecting daughter cards to an electrical backpanel, and more particularly to a high density electrical connector for connecting daughter cards to an electrical backpanel. The daughter card side of the connector and backpanel side of the interconnection system each use multiple grounding methods to ensure enhanced grounding of the respective sides of the connector to ground planes on the backpanel and daughter card, respectively. The signal carrying contacts on the daughter card and backpanel sides of the connector each have a mating grounding post to ensure reduced cross-talk between signals transmitted through adjacent contacts.
BACKGROUND OF THE INVENTION
Electrical interconnect systems (including electronic interconnect systems) are used for interconnecting electrical and electronic systems and components. In general, electrical interconnect systems include both a projection-type interconnect component, such as a conductive pin, and a receiving-type interconnect component, such as a conductive socket. In these types of electrical interconnect systems, electrical interconnection is accomplished by inserting the projection-type interconnect component into the receiving-type interconnect component. Such insertion brings the conductive portions of the projection-type and receiving-type interconnect components into contact with each other so that electrical signals may be transmitted through the interconnect components. In a typical interconnect system, a plurality of individual conductive pins are positioned in a grid formation and a plurality of individual conductive sockets are arranged to receive the individual pins, with each pin and socket pair transmitting a different electrical signal.
Computer and telecommunication applications frequently require high density interconnect systems for transferring signals between backplanes and attached devices, for example daughter cards. The high speed signals that are transferred through such interconnects are susceptible to cross-talk due to the signal speeds and proximate locations of the signal carrying conductors adjacent to each other.
High-density electrical interconnect systems are characterized by the inclusion of a large number of interconnect component contacts within a small area. By definition, high-density electrical interconnect systems have a greater number of connections in the same space required by lower-density interconnect systems. The short signal paths associated with high-density interconnect systems allows such systems to transmit electrical signals at higher speeds. Because modern telecommunication equipment and computers require higher circuit densities, there is a need for interconnect systems to connector such higher density circuits while avoiding introducing cross-talk due to the density of the signal paths carried by such interconnect systems.
Several high-density electrical interconnect systems have been proposed such as those disclosed in U.S. Pat. Nos. 5,575,688 and 5,634,821. The major drawback of such systems is that the high density has the significant drawback of inducing cross talk between signal contacts because the signal contacts are closely spaced. Cross talk is undesired signals in an electrical circuit as a result of coupling between transmission circuits. Thus, there is a need in the art for a high density electrical interconnect system that reduces or eliminates cross talk between closely spaced electrical signal contacts.
SUMMARY OF THE INVENTION
It is, therefore, an object of the present invention to provide a high density electrical interconnect system that reduces or eliminates at the desired transmission speed cross talk between closely spaced electrical signal contacts.
It is another object of the present invention to provide a high density electrical interconnect system that is cost effective to manufacture and reliable in operation.
It is yet another object of the present invention to provide a high density electrical interconnect system that uses multiple grounding methods.
It is a further object of the present to provide a high density electrical interconnect system that has a central ground contact.
It is yet a further object of the present invention to provide a high density connector capable of being press-fit into a circuit board.
The present invention provides an electrical interconnect system using multiple grounding methods to reduce or prevent spurious signals from interfering with high density contacts carrying high speed transmissions. A first connector includes an insulative pillar partially surrounded by a plurality of signal contacts. A ground contact is at least partially located within the insulative pillar. A second connector includes a corresponding plurality of flexible signal contacts for mating with the signal contacts adjacent the insulative pillar. The second connector also includes a ground contact for receiving the ground contact of the first connector. The ground contacts provide a first method of providing a ground path to reduce spurious signals from entering the signal path. An electrically conducting shield is located outside the signal contacts when the first and the second connectors are mated. The first connector includes a member which provides a ground path between the first connector and the electrically conducting shield. Advantageously, the electrical interconnect system can use two grounding methods which are particularly important in a high density electrical interconnect system where the contacts are closely spaced and susceptible to noise and other spurious signals.
These and other objects of the present invention are achieved by an electrical interconnect system including a first electrical connector having a plurality of spaced apart sets of electrically conductive contacts. Each contact set has multiple signal contacts spaced outwardly from a central ground contact. Each of the ground contacts has an end for contact with a ground plane in a first printed circuit board and a connector end. Each of the signal contacts has a card end for contact with a signal path in the first printed board and a connector end. The electrical interconnect system includes a second electrical connector having a plurality of spaced apart sets of electrically conductive contacts. Each contact set has multiple signal contacts spaced outwardly from a central ground contact. An insulator at least partially surrounds the central ground contact and multiple signal contacts are spaced outwardly from the insulator. Each of the ground contacts has an end for contact with a ground plane in a second printed circuit board and a connector end. Each of the signal contacts has an end for contact with a signal path in the second printed circuit board and a connector end. When the first electrical connector is mated with the second electrical connector, the ground contacts in the second electrical connector and the first electrical connector are in contact and the signal contacts in the first electrical connector and the second electrical connector are in contact.
The foregoing and other objects of the present invention are achieved by an electrical interconnect system including a first support element having a first plurality of electrically conductive contacts secured to the first support element. Each of the contacts of the first plurality of contacts has a substantially freestanding, flexible contact section. The contact sections of the first plurality of contacts are arranged in a first array of groups of multiple contact sections positioned in rows and columns. Each of the contact sections of the first array has a contact surface on one side of the contact section. A plurality of central ground contacts are each secured to the first support element and positioned between a corresponding group of the first plurality of electrically conductive contacts. The electrical interconnect system includes a second support element having a plurality of insulative pillars a
Bradley Robert M.
Perugini Michael N.
Litton Systems Inc.
Lowe Hauptman & Gilman & Berner LLP
Nguyen Khiem
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