High density chip carrier with integrated passive devices

Details High density chip carrier with integrated passive devices High density chip carrier with integrated passive devices

2005-11-08

2005-11-08

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S645000, C438S740000

Reexamination Certificate

active

06962872

ABSTRACT:
A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.

REFERENCES:
patent: 5811868 (1998-09-01), Bertin et al.
patent: 6221769 (2001-04-01), Dhong et al.
patent: 6502231 (2002-12-01), Pang et al.
patent: 6638077 (2003-10-01), Fan et al.
patent: 6645851 (2003-11-01), Ho et al.
patent: 6653676 (2003-11-01), Tsu et al.
Stanley Wolf Silicon Processing for the VSLI Era vol. 2 Lattice Press 1990 pp. 56 and 605.

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