High current MOS transistor bridge structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257338, 257343, H01L 2910

Patent

active

054499364

ABSTRACT:
A high current MOS transistor integrated bridge structure includes at least two arms, each having a first and a second MOS transistor. The structure is formed on an N++ substrate forming a positive potential output terminal, and an N-type epitaxial layer. For each first transistor, an L shaped region is formed of a horizontal N+ region which is connected to the surface through an N++ vertical region. Forming a corresponding alternating current input with this region is an N type region which has within it a succession of P type regions, and a pair of N+ type regions forming a negative potential output terminal. For each second transistor, an N+ region has N++ lateral regions extending to the surface, and includes an N type region containing a succession of P type regions and a pair of N+ regions forming corresponding alternating current inputs. The first transistor of each arm is entirely contained within a P type isolation region which has P+ regions extending to the surface of the substrate.

REFERENCES:
patent: 4535203 (1985-08-01), Jenkins et al.
patent: 4823065 (1989-04-01), Gousset
patent: 4866556 (1989-09-01), Hebenstreit
patent: 4949142 (1990-08-01), Contiero et al.
patent: 5045900 (1991-09-01), Tamagawa
patent: 5053838 (1991-10-01), Fujihira et al.
Technical Digest, International Electron Devices Meeting 1987 Washington, D.C., pp. 766-769.

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