Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-05-31
1986-07-22
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
134 2217, 134 27, 134 29, 156644, 156645, 156668, 156902, 252 795, 252156, 427307, B44C 122, B29C 1708, C03C 1500, C03C 2506
Patent
active
046017836
ABSTRACT:
Aqueous, alkaline, liquid solutions consisting essentially of NaMnO.sub.4 and NaOH provide high etch rates for, e.g., printed circuit boards. The solutions can be used to desmear and etchback, and produce manganese residues on the surface of the board which are readily removed by acid neutralization alone.
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Morton Thiokol Inc.
Powell William A.
Sheridan Richard J.
White Gerald K.
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