High breakdown voltage semiconductor device and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S345000, C257S347000, C257S403000, C257S409000, C257S329000, C257S349000

Reexamination Certificate

active

07973361

ABSTRACT:
A high breakdown voltage semiconductor device is formed using an SOI substrate comprising a support substrate, an insulating film, and an active layer. The high breakdown voltage semiconductor device comprises an N-type well region and a P-type drain offset region formed on the active layer, a P-type source region formed on the well region, a P-type drain region formed on the drain offset region, a gate insulating film formed in at least a region interposed between the source region and the drain offset region of the active layer, and a gate electrode formed on the gate insulating film. The device further comprises an N-type deep well region formed under the drain offset region. A concentration peak of N-type impurity for formation of the deep well region is located deeper than a concentration peak of P-type impurity for formation of the drain offset region.

REFERENCES:
patent: 6380566 (2002-04-01), Matsudai et al.
patent: 6693339 (2004-02-01), Khemka et al.
patent: 6828631 (2004-12-01), Rumennik et al.
patent: 08-148684 (1996-06-01), None
patent: 2004-096083 (2004-03-01), None
Chinese Office Action, with English translation, issued in Chinese Patent Application No. 200610067980.2, mailed Mar. 27, 2009.

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