Active solid-state devices (e.g. – transistors – solid-state diode – With means to increase breakdown voltage threshold – In integrated circuit
Reexamination Certificate
2006-11-14
2006-11-14
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
With means to increase breakdown voltage threshold
In integrated circuit
C257S491000, C257S487000, C257S493000
Reexamination Certificate
active
07135751
ABSTRACT:
A high breakdown voltage junction terminating structure having a loop-like RESURF structure formed on a SOI substrate is disclosed. A lateral IGBT, a lateral FWD, an output stage element and a driving circuit are formed in the inside region of the structure. The lateral IGBT and the lateral FWD are surrounded by a trench isolation region as an insulation region. Drain electrodes of high breakdown voltage NMOSFETs are provided on the inside of the high breakdown voltage junction terminating structure. Along with this, a gate electrode and a source electrode of each of the NMOSFETs are provided on the outside of the high breakdown voltage junction terminating structure. The periphery of the high breakdown voltage junction terminating structure is surrounded by a trench isolation region as a second insulation region. A control circuit is provided on the outside of the second insulation region. With this structure, a high breakdown voltage semiconductor device is obtained at low cost, in which power elements, circuits for driving the power elements and logic elements for controlling the power elements are integrated together into the same chip.
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Fujihira et al., “Self-shielding: New High-Voltage Inter-Connection Technique for HVICs”, IEEE,0-7803-3106-0, 1996, pp. 231-234, (Reference submitted in IDS of Jul. 21, 2004).
T. Fujihira et al.; “Self-shielding: New High-Voltage Inter-Connection Technique for HVICs”; IEEE, 0-7803-3106-0, 1996; pp. 231-234.
Fujihira Tatsuhiko
Jimbo Shinichi
Fuji Electric Device Technology Co. Ltd.
Rossi Kimms & McDowell LLP
Wilson Scott R.
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