Heterojunction bipolar transistor and method for fabricating...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Having heterojunction

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S172000, C438S189000

Reexamination Certificate

active

07001820

ABSTRACT:
The following layers are successively formed on a heavily-doped n-type first subcollector layer: a heavily-doped n-type second subcollector layer made of a material having a small band gap; an i-type or a lightly-doped n-type collector layer; a heavily-doped p-type base layer; an n-type emitter layer made of a material having a large band gap; a heavily-doped n-type emitter cap layer; and a heavily-doped n-type emitter contact layer made of a material having a small band gap. Alloying reaction layers are formed under an emitter electrode, a base electrode and a collector electrode.

REFERENCES:
patent: 6403436 (2002-06-01), Tanomura
patent: 2001-308103 (2001-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heterojunction bipolar transistor and method for fabricating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heterojunction bipolar transistor and method for fabricating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heterojunction bipolar transistor and method for fabricating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3642049

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.