Heterogeneous interconnection architecture for programmable...

Electronic digital logic circuitry – Multifunctional or programmable – Significant integrated structure – layout – or layout...

Reexamination Certificate

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C326S041000, C326S044000, C326S101000

Reexamination Certificate

active

06828824

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates to programmable logic devices (PLDs) and more particularly to an improved interconnect architecture for such devices.
Programmable logic devices (PLDs) are a widely used form of integrated circuit due to the flexibility provided by their customizable nature. In general, PLDs include field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), simple programmable logic devices, and laser programmable devices. Architecturally, a PLD includes logic blocks and input/output (I/O) blocks, which are connectable through a programmable interconnect structure or network.
A typical PLD is an integrated circuit chip that, wholly or in part, includes an array of one or more logic blocks, I/O, and a programmable routing or interconnect network that can be programmed by a user to provide an interconnection between the logic blocks and I/O circuits to achieve a desired logic function. The PLD can be a standalone device or can be embedded in a larger integrated circuit such as ASICs or the like. Exemplary forms of such devices are disclosed in U.S. Pat. Nos. 5,825,202 and 5,687,325.
The logic blocks may include a fixed logic function or may have programmable interconnections or functionality. The logic blocks may be further broken down as sub-blocks or grouped together as a cluster of blocks. The blocks may also include I/O circuits, which typically enable connection of the chip to external circuits or to other parts of the chip as in the case of embedded FPGAs. The I/O blocks are typically arranged at the periphery of a chip. A PLD is normally arranged as a regular array of logic blocks, each of which may be identical or may be of several different types such as RAM blocks, look-up-table based blocks, P-term based blocks, etc. The conductors of the programmable interconnect network array are typically arranged along rows and columns defined by the array of logic blocks as shown schematically in FIG.
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The interconnect structure of a PLD includes pre-fabricated wires and pre-fabricated switches which can be programmed to electrically connect different logic blocks to provide a desired function. The connections between the conductors (wires) and the logic blocks and between different wire segments is implemented by means of programmable switches at predetermined interconnection points. The programmable switches may be implemented as pass-transistors, tri-state buffers, fuses, antifuses, or combinations thereof. Laser programming of interconnections may also be achieved by burning off the metal conductors at desired locations. In some cases a switch state can be controlled by a static or dynamic random access memory (SRAM or DRAM), read only memory (ROM), electrically programmable read only memory (EPROM), electrically erasable and programmable read only memories (EEPROMs), flash memory or any other variation or combination of the above memory. Various types of switches are well known in the art and are described in, for example, U.S. Pat. Nos. 4,870,302 and 5,955,751, to list a few.
There are a number of tradeoffs involved in the design of PLDs. A PLD designer or architect is constrained by various operational parameters such as speed of circuits implemented in the PLD, semiconductor or silicon area required for a given logic capacity, power dissipation of the PLD once it has been programmed by a user, reliability (e.g., low glitch probability), and routing flexibility. A PLD architect cannot know before hand all the many uses for which a user may program the device. Thus PLDs are designed to be as general as possible.
For example, a PLD architect's objective may be to minimize the surface area of the PLD while maximizing the logic capacity. That is, maximize the number and functionality of logic blocks and provide sufficient interconnect resources and flexibility to allow as broad a range of circuit implementations as possible. Another design objective may be to maximize the speed of circuits implemented in the PLD while minimizing the surface area, logic, and interconnect resources required to implement the circuits. For example, a PLD architect knows that speed can be improved by reducing the number of programmable connection switches, but this comes at the expense of routing flexibility. Reliability in terms of glitch prevention can be improved by spacing interconnect wires further apart, but this comes at the expense of area.
Consequently, one area of focus in PLD architecture design is the interconnect network architecture, where the objective is to minimize the surface area required for the interconnect resources while maximizing the speed and minimizing the PLD resources required to implement circuits on the PLD. The interconnect architecture here refers to interconnect conductors, the programmable switches, and the interface between them and the logic blocks. U.S. Pat. No. 5,907,248 provides a background on various interconnection architectures and improvements thereto.
However, circuits implemented in PLDs tend to have different parts with different requirements. For example, some critical paths of the circuit have to be fast to meet timing requirements, some parts (e.g., clock signals) need to be glitch free, and parts not speed sensitive should use as little silicon area or PLD resources as possible.
Most PLD architectures do not take into account this circuit heterogeneity. Most of the prior art uses a homogenous interconnection architecture wherein parameters such as wire widths, spacing between wires, dimensions of the transistors used in the buffers and switches, interface circuits between the wires/switches, and the logic blocks are constant throughout the PLD. Furthermore, homogenous architectures are easier for CAD tools to map circuit descriptions into the PLD architecture.
Current interconnect architectures typically vary a single parameter in order to optimize the PLD. For example Actel's U.S. Pat. No. 5,073,729, Altera's U.S. Pat. No. 5,900,743, and Xilinx U.S. Pat. Nos. 5,801,546 and 5,907,248, describe PLD architectures in which optimization is limited to using different lengths of interconnect wires. For example, in U.S. Pat. No. 5,900,743, horizontal conductors of many different lengths make it possible to interconnect horizontally aligned logic regions using conductors that are close to the appropriate lengths. On the other hand, U.S. Pat. No. 5,942,913 describes an interconnect structure using a mixture of buffered and unbuffered interconnect lines. In both cases, optimization is limited to just one parameter. Thus, these architectures are limited in that they do not offer a user sufficient flexibility when designing a circuit that requires different PLD interconnect resources for different parts of the circuit.
Accordingly, there is a need for an improved PLD architecture that is optimized in terms of one or more selected operational parameters such as speed, power, area, flexibility and reliability, while minimizing the impact on the remaining parameters.
SUMMARY OF THE INVENTION
An advantage of the invention is the provision of a PLD architecture that is optimized for a selected one or more operational parameters, while minimizing the impact on the remaining parameters. For example the operational parameters may include speed, area, power, reliability and flexibility.
In accordance with this invention, a PLD includes one or more function blocks and a plurality of different groups of interconnect resources. Each group is programmably connectable to one or more of the function blocks, wherein a first number of one type of interconnect resource is optimized for a first operational parameter of the PLD and a second number of the same type of interconnect resource is optimized for a second operational parameter.
The function blocks may be logic blocks, input/output (I/O) circuits, or combinations of both.
In one embodiment of the invention, the interconnect resources include a plurality of interconnect conductors (e.g., wires) wherein a first number of conductors has a spacing

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