Hermetically tight glass-metal housing for semiconductor compone

Details Hermetically tight glass-metal housing for semiconductor compone Hermetically tight glass-metal housing for semiconductor compone

1988-09-20

1990-07-10

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29827, H01L 2302

Patent

active

049408550

ABSTRACT:
A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.

REFERENCES:
patent: 3203083 (1965-08-01), Obenhaus
patent: 3244802 (1966-04-01), Sturtevant et al.
patent: 3421203 (1969-01-01), Ullman et al.
patent: 3535530 (1970-10-01), Cooper et al.
patent: 3735213 (1973-05-01), Kansky
patent: 3828210 (1974-08-01), Livenick et al.
patent: 3857993 (1974-12-01), Gregory
patent: 4523218 (1985-06-01), Kato

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