Hermetically sealed die package with floating source

Details Hermetically sealed die package with floating source Hermetically sealed die package with floating source

1990-06-26

1991-08-06

Jackson, Jr., Jerome

357 80, 357 79, 357 75, H01L 2302, H01L 2312, H01L 2342, H01L 3902

Patent

active

050381970

ABSTRACT:
An hermetically sealed package for a die comprised of a base plate, a side wall mounted on the brace plate, a printed circuit board connecting terminals on one side of the die to a first lead, connector clips connecting terminals on the other side of die to a bus having posts extending, wires connecting other terminals on the other side of the die to runners on the circuit board, leads respectively extending from each runner, a cover lid hermetically sealed to the side wall, the lid having openings hermetically sealed by insulators having slots through which the leads respectively extend in sealed relationship.

REFERENCES:
patent: 4639759 (1987-01-01), Neidig et al.
patent: 4694322 (1987-09-01), Sakurai et al.
patent: 4739449 (1988-04-01), Kaufman
patent: 4879633 (1989-11-01), Kaufman
patent: 4907067 (1990-03-01), Derryberry

Affiliated with

Also associated with

Rating

Hermetically sealed die package with floating source does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed die package with floating source, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed die package with floating source will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1990840