Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1990-06-11
1993-06-29
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174152GM, 228113, 228114, 156 735, H01L 2302, H01B 1726
Patent
active
052236722
ABSTRACT:
A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.
REFERENCES:
patent: 2450780 (1948-10-01), Bucklen, 3D
patent: 2458748 (1949-01-01), Stupakoff
patent: 3017452 (1962-01-01), Rongved
patent: 3702409 (1972-11-01), Goodings et al.
patent: 4213004 (1980-07-01), Acker et al.
patent: 4238043 (1980-12-01), Minami et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4574299 (1986-03-01), Glascock, II et al.
patent: 4659245 (1987-04-01), Hirao et al.
patent: 4688009 (1987-08-01), Ferguson et al.
patent: 4708060 (1987-11-01), Bickes, Jr. et al.
patent: 4746582 (1988-05-01), Tsuno
patent: 4757292 (1988-07-01), Basil, Jr. et al.
patent: 4801488 (1989-01-01), Smith
patent: 4805009 (1989-02-01), Pryor et al.
patent: 4839716 (1989-06-01), Butt
patent: 4841101 (1989-06-01), Pollock
patent: 4955684 (1990-09-01), Shiga
patent: 4960096 (1990-10-01), Sukimoto et al.
patent: 5001299 (1991-03-01), Hingorany
Grgas Marijan D.
Pinneo George G.
Ledynh Bot Lee
Picard Leo P.
Schivley G. Gregory
Steinberger James M.
Taylor Ronald L.
LandOfFree
Hermetically sealed aluminum package for hybrid microcircuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hermetically sealed aluminum package for hybrid microcircuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed aluminum package for hybrid microcircuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1757247