Hermetically packaging a microelectromechanical switch and a...

Details Hermetically packaging a microelectromechanical switch and a... Hermetically packaging a microelectromechanical switch and a...

2005-09-13

2005-09-13

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

Reexamination Certificate

active

06943419

ABSTRACT:
A film bulk acoustic resonator wafer and microelectromechanical switch wafer may be combined together in face-to-face abutment with sealing material between the wafers to define individual modules. Electrical interconnects can be made between the switch and the film bulk acoustic resonator within a hermetically sealed chamber defined between the switch and the film bulk acoustic resonator.

REFERENCES:
patent: 5668033 (1997-09-01), Ohara et al.
patent: 6025767 (2000-02-01), Kellam et al.
patent: 6114794 (2000-09-01), Dhuler et al.
patent: 6392144 (2002-05-01), Filter et al.
patent: 6436853 (2002-08-01), Lin et al.

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