Hermetic semiconductor device having jumper leads

Details Hermetic semiconductor device having jumper leads Hermetic semiconductor device having jumper leads

1994-05-06

1995-01-10

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257686, 257700, 257704, 257778, H01L 3902

Patent

active

053810392

ABSTRACT:
A fine-pitch hermetic device (10) can be manufactured wherein two sets of wire bonds (18 & 20) are used to electrically connect a semiconductor die (12) to a leadframe (16). Jumper leads or conductive pads (28) are placed on an inner surface of a ceramic base (14) to electrically interconnect the two sets of wire bonds. The jumper leads enables shorter wire lengths to be used. The leadframe is attached to the ceramic base with glass embed technology. A cap (22) is affixed to the base with a hermetic seal (24). The invention is also compatible with flip-chip dice and multichip modules.

REFERENCES:
patent: 4530002 (1985-07-01), Kanai
patent: 4558346 (1985-12-01), Kida et al.
patent: 4622433 (1986-11-01), Frampton
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 4902854 (1990-02-01), Kaufman
patent: 4985753 (1991-01-01), Fujioka et al.
patent: 4987477 (1991-01-01), Ikeno
patent: 5091772 (1992-02-01), Kohara et al.
patent: 5103291 (1992-04-01), Lian-Mueller
patent: 5111277 (1992-05-01), Medeiros, III et al.
patent: 5134246 (1992-07-01), Beppu et al.
patent: 5175397 (1992-12-01), Lindberg
"Stackable J Leaded Chip Carrier," IBM Technical Disclosure Bulletin, vol. 28, No. 12, May 1986, pp. 5174-5175.

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