Hermetic protection for integrated circuits

Details Hermetic protection for integrated circuits Hermetic protection for integrated circuits

1994-03-10

1996-01-02

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257703, 257760, 257791, 437235, H01L 23053, H01L 2312

Patent

active

054811350

ABSTRACT:
This invention relates to integrated circuits which are protected from the environment. Such circuits are hermetically sealed by applying ceramic layers to the top metallization.

REFERENCES:
patent: 3615272 (1971-10-01), Collins et al.
patent: 4340619 (1982-07-01), Gaul, Jr.
patent: 4540803 (1985-09-01), Cannady
patent: 4749631 (1988-06-01), Haluska et al.
patent: 4756977 (1988-07-01), Haluska et al.
patent: 4849296 (1989-07-01), Haluska et al.
patent: 4888226 (1989-12-01), Wong
patent: 4999397 (1991-03-01), Weiss et al.
patent: 5010159 (1991-04-01), Bank et al.
patent: 5011706 (1991-04-01), Tamay et al.
patent: 5116637 (1992-05-01), Baney et al.
patent: 5136364 (1992-08-01), Byrne
patent: 5145723 (1992-09-01), Ballance et al.
Gentle, `Oxidation of Hydrogen Silsesquioxane by Vapid Thermal Processing`, pp. 146-164.
Electronic packaging & production, vol. 32, No. 2, p. 35.
Chandra, `Low temperature ceramic coatings for environmental protection of integrated circuits`, Electronic Packaging Material Science Symposium, Nov. 26, 1990, Boston, pp. 97-108.

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