Height gauge device for wafer

Abrading – Precision device or process - or with condition responsive... – With feeding of tool or work holder

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Details

3350104, 33832, B24B 4900

Patent

active

060196645

ABSTRACT:
A height gauge device for wafer, which is mounted under a cooling water pipe of a back-grinding machine; the device comprises a height gauge box, a measuring rod, a L-shaped linking rod and a resilient member; a signal sensor is mounted inside the height gauge box for measuring the height of a wafer; both ends of the measuring rod are connected with the signal sensor and the L-shaped linking rod respectively; the L-shaped linking rod is mounted with a probing needle; the resilient member is mounted between the L-shaped linking and the cooling water pipe; in height gauging operation, the probing needle on the L-shaped linking needle should be raised first so as to put a wafer under the probing needle, and to have the probing needle pressed against the wafer by means of the resilient force of the resilient member; consequently, the resilient member is subject to elastic fatigue or break; the resilient member of the height gauge device can be replaced directly without opening the height box so as to save time and maintenance cost.

REFERENCES:
patent: 2573075 (1951-10-01), Watson
patent: 3119187 (1964-01-01), Meyer
patent: 5239763 (1993-08-01), Kulp

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