Heatsink package for flip-chip IC

Details Heatsink package for flip-chip IC Heatsink package for flip-chip IC

1986-12-03

1987-10-06

Larkins, William D.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, 174 52FP, 361386, 357 69, 357 74, 357 80, H01L 2334

Patent

active

046986634

ABSTRACT:
A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the opening and to make contact with the semiconductor element via the opening, so that heat generated by the semiconductor element is conducted directly to the heatsink member. A method of producing the semiconductor device comprises the steps of mounting the semiconductor element on the substrate, covering the semiconductor element by the cap which is fixed to the substrate, and mounting the heatsink member on the cap to cover the opening and to make contact with the semiconductor element via the opening.

REFERENCES:
patent: 3476986 (1969-11-01), Tsuji
patent: 4069498 (1978-01-01), Joshi
patent: 4340902 (1982-07-01), Honda et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4620215 (1986-10-01), Lee
patent: 4620216 (1986-10-01), Horvath
patent: 4626960 (1986-12-01), Hamano et al.
IBM Technical Disclosure Bulletin (vol. 26, No. 7A, 12/83) Low Thermal Expansion, High Thermal Conductance Cap for Glass Ceramic Modules.

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