4. Electricity: conductors and insulators
  5. Feedthrough or bushing
  6. Compression

Yasumasa Wakasugi

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Heatsink package for flip-chip IC

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Heatsink package for flip-chip IC

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Low dielectric constant ceramic substrate

Compositions: ceramic – Ceramic compositions – Refractory
Patent

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Semiconductor device and method of producing semiconductor devic

Fishing – trapping – and vermin destroying
Patent

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Profile ID: LFUS-PAI-P-1227378

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