Heatsink arrangement for semiconductor device

Details Heatsink arrangement for semiconductor device Heatsink arrangement for semiconductor device

2006-01-10

2006-01-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S675000, C257S707000, C257S712000, C257S717000, C257S720000, C257S722000, C257S724000

Reexamination Certificate

active

06984887

ABSTRACT:
A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.

REFERENCES:
patent: 5097318 (1992-03-01), Tanaka et al.
patent: 5357400 (1994-10-01), Takekawa
patent: 5404273 (1995-04-01), Akagawa
patent: 5466069 (1995-11-01), Agari
patent: 6011299 (2000-01-01), Brench
patent: 6060772 (2000-05-01), Sugawara et al.
patent: 2001/0002051 (2001-05-01), Matsumoto
patent: 2-26256 (1990-02-01), None
patent: 4-40539 (1992-04-01), None
patent: 2853618 (1998-11-01), None
patent: 2000-260937 (2000-09-01), None

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