Heatsink

Details Heatsink Heatsink

2008-04-15

2008-04-15

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S078000, C165S121000, C165S185000, C257S722000, C361S703000

Reexamination Certificate

active

11231723

ABSTRACT:
Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end contacting a heat source to absorb heat from the heat source and a heat-dissipating region that extends from both sides of the heat-absorbing region to absorb heat from the heat-absorbing region and outwardly dissipate the heat, wherein the heat-absorbing regions are tightly joined to one another by applying an external pressure to form a central portion and the heat-dissipating regions are radially spread out about the central portion, wherein each of the heat-dissipating regions includes a long heat-dissipating region and a short heat-dissipating region, which are asymmetric with respect to the central portion. Accordingly, the heatsink can efficiently dissipate heat generated from the heat source mounted on an edge of a narrow circuit board by efficiently utilizing a space over the circuit board.

REFERENCES:
patent: 5583746 (1996-12-01), Wang
patent: 6289975 (2001-09-01), Kuo
patent: 6698499 (2004-03-01), Wagner et al.
patent: 6712127 (2004-03-01), Lee
patent: 6782941 (2004-08-01), Lee
patent: 6958915 (2005-10-01), Wang et al.
patent: D540750 (2007-04-01), Lee
patent: 2001/0010264 (2001-08-01), Kuo

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