Heating apparatus to heat wafers using water and plate with...

Details Heating apparatus to heat wafers using water and plate with... Heating apparatus to heat wafers using water and plate with...

2007-12-25

2007-12-25

Tadesse, Yewebdar (Department: 1734)

Coating apparatus

With means to centrifuge work

C118S300000, C118S302000, C118S725000, C392S418000

Reexamination Certificate

active

10680359

ABSTRACT:
Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support assembly, a fluid outlet positioned in a central location of the disk shaped member, and a plurality of turbolators positioned on an upper surface of the disk shaped member, the turbolators being configured to generate a uniform turbulent flow of fluid traveling from the fluid outlet to a perimeter of the substrate. The method includes flowing a heated processing fluid over a plurality of turbolators that are positioned under a substrate being processed to control the temperature of the substrate during processing.

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