Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-09-29
2008-08-26
Paik, Sang (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S544000
Reexamination Certificate
active
07417206
ABSTRACT:
A heater that is capable of heating an object to a desired temperature in a short period while minimizing the temperature difference the surface of the object is provided. The heater comprising a plate having a first surface and a second surface, the first surface being a mount surface whereon an object is placed and having a resistive heating member; wherein the resistive heating member is formed in a continuous band having arc bands located on one of two concentric circles of different radii, at least one arc band located on the other circle, and linkage arc band that connects the arc band located on the one circle and the arc band located on the other circle; while the distance between the adjacent linkage arc bands is smaller than the distance between the arc band located on the one circle and the arc band located on the other circle.
REFERENCES:
patent: 2409244 (1946-10-01), Bilan
patent: 5490228 (1996-02-01), Soma et al.
patent: 5616024 (1997-04-01), Nobori et al.
patent: 6080970 (2000-06-01), Yoshida et al.
patent: 6437296 (2002-08-01), Choi
patent: 6465763 (2002-10-01), Ito et al.
patent: 6653603 (2003-11-01), Yamaguchi
patent: 6686570 (2004-02-01), Furukawa et al.
patent: 6746972 (2004-06-01), Kim et al.
patent: 6753507 (2004-06-01), Fure et al.
patent: 6849938 (2005-02-01), Ito
patent: 6960743 (2005-11-01), Hiramatsu et al.
patent: 7071551 (2006-07-01), Hiramatsu et al.
patent: 2002/0043528 (2002-04-01), Ito
patent: 2003/0183816 (2003-10-01), Goto
patent: 2004/0108308 (2004-06-01), Okajima
patent: 2004/0149718 (2004-08-01), Ito et al.
patent: 2006/0000822 (2006-01-01), Nakamura
patent: 1662105 (2005-08-01), None
patent: 1 089 593 (2001-04-01), None
patent: 1 109 423 (2001-06-01), None
patent: 04-101381 (1992-04-01), None
patent: 07-065935 (1995-03-01), None
patent: 07-220862 (1995-08-01), None
patent: 10-223642 (1998-08-01), None
patent: 10-229114 (1998-08-01), None
patent: 11-121385 (1999-04-01), None
patent: 11-191535 (1999-07-01), None
patent: 11-339939 (1999-12-01), None
patent: 11-354528 (1999-12-01), None
patent: 2000340343 (2000-12-01), None
patent: 2001-006852 (2001-01-01), None
patent: 2001-068407 (2001-03-01), None
patent: 2001-102157 (2001-04-01), None
patent: 2001-203156 (2001-07-01), None
patent: 2001-223257 (2001-08-01), None
patent: 2001-257200 (2001-09-01), None
patent: 2001-267043 (2001-09-01), None
patent: 2001-313249 (2001-11-01), None
patent: 2002-076102 (2002-03-01), None
patent: 2002-170655 (2002-06-01), None
patent: 2002-184683 (2002-06-01), None
patent: 2002-231421 (2002-08-01), None
patent: 2002-231793 (2002-08-01), None
patent: 2002-237375 (2002-08-01), None
patent: 2003077779 (2003-03-01), None
patent: 2004-006242 (2004-01-01), None
patent: 2004-111107 (2004-04-01), None
Chinese language office action and its English translation for corresponding Chinese application No. 200510107141.4 lists the references above.
Hogan & Hartson LLP
Kyocera Corporation
Paik Sang
LandOfFree
Heater, wafer heating apparatus and method for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heater, wafer heating apparatus and method for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heater, wafer heating apparatus and method for manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4004254