Heat treatment method

Heating – Processes of heating or heater operation – Including preparing or arranging work for heating

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Details

432 5, 432241, 432152, F27D 500

Patent

active

058138510

ABSTRACT:
When a wafer boat having wafers, objects to be treated, placed thereon is loaded into a reaction tube, which is then raised in temperature by a heating section at a speed of 50.degree. C./min or more, a pressure reduction degree of the reaction tube is lowered or a hydrogen gas is supplied. A surface roughness of a portion in contact with the wafers on the wafer boat is 50 .mu.m or less. Thereby, a heat transfer coefficient relative to the wafers is improved to suppress an in-plane temperature difference smaller. Accordingly, when the objects to be treated are raised in temperature in the reaction tube for heat treatment, it is possible to suppress the in-plane temperature difference of the substances to be smaller to prevent an occurrence of a slip or warp which leads to the lowering of a yield.

REFERENCES:
patent: 5249960 (1993-10-01), Monoe
patent: 5273423 (1993-12-01), Shiraiwa
patent: 5277579 (1994-01-01), Takanabe
patent: 5328360 (1994-07-01), Yokokawa
patent: 5360336 (1994-11-01), Monoe
patent: 5445521 (1995-08-01), Yamaguchi et al.
patent: 5507639 (1996-04-01), Monoe
patent: 5525057 (1996-06-01), Monoe
patent: 5556275 (1996-09-01), Sakata et al.
patent: 5578132 (1996-11-01), Yamaga et al.

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