Heat treatment jig for semiconductor silicon substrate

Details Heat treatment jig for semiconductor silicon substrate Heat treatment jig for semiconductor silicon substrate

2007-01-16

2007-01-16

Wilson, Gregory (Department: 3749)

Heating

Accessory means for holding, shielding or supporting work...

C432S259000, C211S041180

Reexamination Certificate

active

10771225

ABSTRACT:
This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocations that occur as a result of the stress caused by the weight of the wafer itself or the deflection of the heat treatment jig itself.

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