Heating – With work cooling structure – Work holder having selectively usable heating and cooling...
Reexamination Certificate
2011-01-18
2011-01-18
Wilson, Gregory A (Department: 3749)
Heating
With work cooling structure
Work holder having selectively usable heating and cooling...
C432S249000, C219S443100
Reexamination Certificate
active
07871265
ABSTRACT:
In a heat treatment device including a heating chamber having a heating plate heating a semiconductor wafer, a cooling plate cooling the wafer heated by the heating chamber, and a transporting device transporting the wafer into and from the heating chamber, the cooling plate is provided with a coolant passage, a plurality of projections carrying the wafer with a space between the wafer and the surface of the cooling plate, and suction holes neighboring to the respective projections and connected to a suction device.
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Fukuoka Tetsuo
Kitano Takahiro
Terada Kazuo
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
Wilson Gregory A
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