Heat treatment device

Heating – With work cooling structure – Work holder having selectively usable heating and cooling...

Reexamination Certificate

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Details

C432S249000, C219S443100

Reexamination Certificate

active

07871265

ABSTRACT:
In a heat treatment device including a heating chamber having a heating plate heating a semiconductor wafer, a cooling plate cooling the wafer heated by the heating chamber, and a transporting device transporting the wafer into and from the heating chamber, the cooling plate is provided with a coolant passage, a plurality of projections carrying the wafer with a space between the wafer and the surface of the cooling plate, and suction holes neighboring to the respective projections and connected to a suction device.

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patent: 6474986 (2002-11-01), Oda et al.
patent: 6875466 (2005-04-01), Matsui et al.
patent: 7418970 (2008-09-01), Sugimoto et al.
patent: 7628612 (2009-12-01), Otsuka et al.
patent: 7645136 (2010-01-01), Arai et al.
patent: 2007/0048979 (2007-03-01), Fukuoka et al.
patent: 2007/0160947 (2007-07-01), Akimoto et al.
patent: 11-214486 (1999-08-01), None
patent: 2003-037033 (2003-02-01), None
patent: 2006-210400 (2006-08-01), None

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