Heat treatment apparatus, heat treatment method, and...

Details Heat treatment apparatus, heat treatment method, and... Heat treatment apparatus, heat treatment method, and...

2007-04-12

2010-06-29

Kastler, Scott (Department: 1793)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C266S255000

Reexamination Certificate

active

07745347

ABSTRACT:
An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.

REFERENCES:
patent: 2007/0218706 (2007-09-01), Matsuoka
patent: 2007/0286709 (2007-12-01), Fujii et al.
patent: 2002-93799 (2002-03-01), None
patent: 2003-347305 (2003-12-01), None

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