Heat treatment apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support

Reexamination Certificate

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Details

C219S390000

Reexamination Certificate

active

11350766

ABSTRACT:
A processing gas is prevented from entering into a space below a placement table. A supporting surface for supporting the lower face of a placement table is provided at an inner circumferential portion of the upper end of a support column. A circumferentially extending purge gas groove is formed outside the supporting surface, in an intermediate circumferential portion of the upper end of the support column. A narrow flow path is provided outside the purge gas groove, at a position corresponding to an outer circumferential portion of the upper end of the support column. A purge gas diffuses in the circumferential direction in the purge gas groove and flows out to the outside from the narrow flow path. Such a flow of the purge gas prevents a processing gas from entering into the purge gas groove and a space below the placement table.

REFERENCES:
patent: 5624499 (1997-04-01), Mizuno et al.
patent: 5938850 (1999-08-01), Arami et al.
patent: 5985033 (1999-11-01), Yudovsky et al.
patent: 2002/0045362 (2002-04-01), Yang et al.
patent: 2003/0051665 (2003-03-01), Zhao et al.
patent: 2004/0020599 (2004-02-01), Tanaka et al.
patent: 2004/0084315 (2004-05-01), Mizohata et al.
patent: 2004/0211764 (2004-10-01), Doering et al.
patent: 7-58016 (1995-03-01), None
patent: 8-302473 (1996-11-01), None
patent: 9-50965 (1997-02-01), None
patent: 2001-509645 (2001-07-01), None
patent: WO 99/03131 (1999-01-01), None

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