Heat transfer system for improved semiconductor processing...

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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C156S345520, C156S345530, C216S067000

Reexamination Certificate

active

10962568

ABSTRACT:
A plasma processing system and methods for processing a substrate using a heat transfer system are provided. The heat transfer system, which is capable of producing a high degree of processing uniformity across the surface of a substrate, comprises a uniformity pedestal supported on and in good thermal contact with a heat transfer member. The uniformity pedestal includes a pin array which provides a conformal substrate support surface (i.e., contact surface) that can conform to the profile of a backside surface of a substrate during processing. To uniformly cool a substrate, a large thermal gradient can be established between the uniformity pedestal and the heat transfer member during the processing of a substrate.

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