Heat stable photocurable resin composition for dry film resist

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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Details

C430S258000, C430S259000, C430S260000, C430S262000, C430S263000, C430S285100, C430S287100, C430S288100, C430S910000

Reexamination Certificate

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10520701

ABSTRACT:
The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 μm and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20–90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.1 to 10% by weight of a leuco triphenylmethane dye of the formula (I), wherein R1is a residue selected from (II), R2is C1–C12alkyl or phenyl which may be mono-, di- or tri-substituted by C1–C6alkyl, trifluoromethyl, C1-6alkoxy, C1-6alkylthio, halogen and nitro; R3is hydrogen or C1–C12alkyl; R4to R9independently of one another are hydrogen or C1–C12alkyl; X is O, S, NH or N—C1–C12-alkyl; (a) to (e) being 100% by weight. The above composition is useful to avoid unfavourable colour generation during the heat lamination

REFERENCES:
patent: 4154463 (1979-05-01), Burri
patent: 4598036 (1986-07-01), Iwasaki et al.
patent: 4725524 (1988-02-01), Elzer et al.

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