Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-09-01
2001-12-04
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C062S259200, C165S080400, C174S015100, C257S714000, C257S722000, C361S699000
Reexamination Certificate
active
06327145
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to apparatus and methods for removal of heat from electronic devices. In particular, the present invention relates to a fluid circulation pump in conjunction with a heat sink for the removal of heat from a microelectronic die.
2. State of the Art
Higher performance, lower cost, increased miniaturization of integrated circuit components, and greater packaging density of integrated circuits are ongoing goals of the computer industry. As these goals are achieved, microelectronic dice become smaller. Accordingly, the density of power consumption of the integrated circuit components in the microelectronic die has increased, which, in turn, increases the average junction temperature of the microelectronic die. If the temperature of the microelectronic die becomes too high, the integrated circuits of the microelectronic die may be damaged or destroyed.
Various apparatus and techniques have been used and are presently being used for removing heat from microelectronic dice. One such heat dissipation technique involves the attachment of a high surface area heat sink to a microelectronic die.
FIG. 5
illustrates an assembly
200
comprising a microelectronic die
202
(illustrated as a flip chip) physically and electrically attached to a substrate carrier
204
by a plurality of solder balls
206
. A heat sink
208
is attached to a back surface
212
of the microelectronic die
202
by a thermally conductive adhesive
214
. The heat sink
208
is usually constructed from a thermally conductive material, such as copper, copper alloys, aluminum, aluminum alloys, and the like. The heat generated by the microelectronic die
202
is drawn into the heat sink
208
(following the path of least thermal resistance) by conductive heat transfer.
High surface area heat sinks
208
are generally used because the rate at which heat is dissipated from a heat sink is substantially proportional to the surface area of the heat sink. The high surface area heat sink
208
usually includes a plurality of projections
216
extending substantially perpendicularly from the microelectronic die
202
. It is, of course, understood that the projections
216
may include, but are not limited to, elongate planar fin-like structures and columnar/pillar structures. The high surface area of the projections
216
allows heat to be convectively dissipated from the projections
216
into the air surrounding the high surface area heat sink
208
. A fan
218
may be incorporated into the assembly
200
to enhance the convective heat dissipation.
Although high surface area heat sinks are utilized in a variety of microelectronic applications, they have not been completely successful in removing heat from microelectronic dice that generate substantial amounts of heat. Therefore, it would be advantageous to develop apparatus and techniques to effectively remove heat from microelectronic dice.
REFERENCES:
patent: 5091824 (1992-02-01), Dzwonczyk
patent: 5646824 (1997-07-01), Ohashi et al.
patent: 5731954 (1998-03-01), Cheon
patent: 6152213 (2000-11-01), Suzuki
Josh Norem, “Axis Terra AXA, This thunderbird box rocks”, Maximum PC, Oct. 2000, pp. 68-69, vol. 5, No. 10, USA.
Dishongh Terrance J.
Dujari Prateek J.
Lian Bin
Searls Damion T.
Intel Corporation
Thompson Gregory
Winkle Robert G.
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