Heat sink for semi-conductor devices having terminals projecting

Details Heat sink for semi-conductor devices having terminals projecting Heat sink for semi-conductor devices having terminals projecting

1982-08-13

1985-05-14

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 65, 174 16HS, H01L 2340, H01L 2334, H01L 2312, H01L 2314

Patent

active

045175853

ABSTRACT:
A heat sink has an integral island portion on which there is a mounting face for heat transfer contact with the sole plate of a semi-conductor device case. Clearance bores are provided in the heat sink to receive the terminal pins of the semi-conductor device. Grooves in the face provide passages under the sole plate for wires connected to the terminal pins. Alternatively, cross passages in the island portion may be employed.

REFERENCES:
patent: 2791731 (1967-05-01), Walker et al.
patent: 2896136 (1959-07-01), Hales
patent: 3025437 (1962-03-01), Namen, Jr. et al.
patent: 3239719 (1966-03-01), Shower
patent: 3396361 (1968-08-01), Sussman
patent: 3780795 (1973-12-01), Arnold
patent: 4151547 (1979-04-01), Rhoades et al.
patent: 4403242 (1983-09-01), Tsurvoka
"Heat Sink"-Bryden, IBM Technical Disclosure Bulletin-vol. 11, No. 10, Mar. 1969, p. 1323.

Affiliated with

Also associated with

Rating

Heat sink for semi-conductor devices having terminals projecting does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink for semi-conductor devices having terminals projecting, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink for semi-conductor devices having terminals projecting will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-771391