Heat sink/circuit board assembly

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

361383, H05K 720

Patent

active

051915120

ABSTRACT:
A heat sink/circuit board assembly allows repairing or inspection of circuit or parts without impairing heat-radiating effect. A sub-heat sink is protruded from a lateral end of the circuit board in a direction parallel to the main surface of the circuit board and is connected to the main heat sink at its protruding portion. The diameter of the opening of the recessed portion of the main heat sink facing the circuit board is made larger than outer diameter of the circuit board. When circuit elements on the main surface of the circuit board facing the recessed portion of the main heat sink are to be repaired or inspected, the main heat sink is connected to the sub-heat sink on a main surface which is on the opposite side to the surface carrying the circuit elements, while the same heat-radiating effect as in the normal condition can be obtained.

REFERENCES:
patent: 4177499 (1979-12-01), Volkmann
patent: 4916575 (1990-04-01), Van Asten

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