Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-03-26
2000-06-13
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 257718, 361710, H05K 720
Patent
active
060757035
ABSTRACT:
A heat sink assembly adapted to mount on a printed circuit board for dissipating heat from a heat generating component of an electronic device. The heat sink assembly includes a base extended upwardly from the printed circuit board, and having a heat conducting surface for conducting heat, and a heat radiating surface opposite of said heat conducting surface for radiating heat from the heat conducting surface; at least one heat generating component positioned in contact with the heat conducting surface of the base; a fastening clip for clamping the heat generating component in contact with the heat conducting surface of the base; a plurality of cooling fins extended from the heat radiating surface of the base at predetermined intervals for dissipating the heat conducted through the heat conducting surface of the base and generated from the heat generating component; and support members extended at opposite ends of the base for protecting the heat generating component and supporting the mounting of said heat sink assembly on the printed circuit board.
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Bushnell Esq. Robert E.
Samsung Electronics Co,. Ltd.
Thompson Gregory
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