Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1983-10-27
1986-01-28
Sikes, William L.
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
16510433, 165185, 357 82, H01L 2336
Patent
active
045675058
ABSTRACT:
Two bodies such as an integrated circuit and a heat sink are maintained in a low stress and high thermal conductance abutment by pressure from capillary attraction. A surface of one of the bodies is provided with grooves preferably having reentrant surfaces. A surface of the other body is brought into abutment with the grooved surface with a liquid therebetween which partially fills the grooves. The grooves act as reservoirs for excess liquid so that a minimum thickness liquid interface is achieved, and the grooves enable trapped gas to escape out the open ends thereby preventing voids between the two bodies. Importantly, the groove geometry enforces a well-defined attractive force between the two surfaces due to the liquid surface tension.
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Tuckerman, D. B. and Pease, R. F. W., High Performance Heat Sinking for VSLI, IEEE Electron Device Letters, vol. EDL-2, No. 5 (May 1981).
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Pease Roger F.
Swanson Richard M.
Tuckerman David B.
Economou Vangelis
Sikes William L.
The Board of Trustees of the Leland Stanford Junior University
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