Heat sink and memory module using the same

Details Heat sink and memory module using the same Heat sink and memory module using the same

2007-09-21

2009-10-20

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S719000, C361S728000, C361S737000, C165S080300, C165S104330, C165S185000, C174S016300

Reexamination Certificate

active

07606035

ABSTRACT:
Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

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English language abstract of Korean Publication No. 2001-0056373.
English language abstract of Korean Publication No. 20-0325122.
English language abstract of Japanese Publication No. 2003-017634.

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