Heat sink and heat spreader assembly

Details Heat sink and heat spreader assembly Heat sink and heat spreader assembly

2005-02-01

2005-02-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S711000, C257S702000, C257S703000, C257S705000, C257S706000, C257S707000, C361S709000

Reexamination Certificate

active

06849941

ABSTRACT:
A heat sink and heat spreader assembly including a solid member of a conductive material and a layer of a low melting alloy having phase change properties bonded to at least one surface of the solid member such that a welded joint is formed there between possessing a thickness of from 0.0001 to 0.020 inches and having a composition consisting essentially of said low melting alloy with the welded joint having an exposed relatively flat surface suitable for direct attachment to an electronic heat source or heat sink respectively.

REFERENCES:
patent: 4630096 (1986-12-01), Drye et al.
patent: 4663649 (1987-05-01), Suzuki et al.
patent: 4876588 (1989-10-01), Miyamoto
patent: 5338971 (1994-08-01), Casati et al.
patent: 6078491 (2000-06-01), Kern et al.
patent: 6084775 (2000-07-01), Bartley et al.
patent: 6731011 (2004-05-01), Verma et al.
patent: 20030114022 (2003-06-01), Franzen et al.

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