Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-06-23
1998-12-01
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 165 803, 361703, 361717, H01L 2334
Patent
active
058443134
ABSTRACT:
A heat sink for semiconductor components has a fin base and a plurality of spaced fins that all have the same height. A side of the base facing the fins is configured convexly with respect to the side of the fin base facing the semiconductor component, so that when the heat sink is used as intended, the roots of its fins are arranged on a surface of constant temperature. This yields a finned heat sink that attains a heat flux density hitherto achievable only with evaporative or fluid coolers.
REFERENCES:
patent: 3766977 (1973-10-01), Pravda et al.
patent: 4541004 (1985-09-01), Moore
patent: 4899210 (1990-02-01), Lorenzetti et al.
patent: 4918571 (1990-04-01), Grabbe
patent: 5079635 (1992-01-01), Koshiyouji et al.
Conrad Electronic Catalog 1990, p. 495.
Siemens Zeitschrift, vol. 42, 1968, No. 7, pp. 521-527.
Catalog from the firm SEIFERT Electronic, 1993, pp. 6-107.
Ostrowski David
Siemens Aktiengesellschaft
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