Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-06-13
2006-06-13
Gilliam, Barbara L. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S302000, C430S494000, C430S944000, C101S453000, C101S463100, C101S465000, C101S466000, C101S467000
Reexamination Certificate
active
07060412
ABSTRACT:
A heat-sensitive composition which forms an image without the removal of material, which does not require any developing treatment after the stage of exposure to heat and comprises: (a) a switchable polymer, (b) an IR absorber, (c) a triazine compound, and (d) a novolak resin.Negative lithographic plate comprising a substrate coated with the said composition.A method for obtaining a negative image on a substrate coated with a composition which is first hydrophilic and then lipophilic after exposure to heat, without the removal of material, the said negative image being obtained by applying a small quantity of energy to the said composition.
REFERENCES:
patent: 5466557 (1995-11-01), Haley et al.
patent: 5985514 (1999-11-01), Zheng et al.
patent: 6165679 (2000-12-01), Van Damme et al.
patent: 6190830 (2001-02-01), Leon et al.
patent: 6475698 (2002-11-01), Monk et al.
patent: 6602648 (2003-08-01), Nakamura
patent: 6610458 (2003-08-01), Miller et al.
patent: 6890700 (2005-05-01), Tomita et al.
patent: 0911153 (1999-04-01), None
patent: 0913253 (1999-05-01), None
patent: 0924065 (1999-06-01), None
patent: 1029668 (2000-08-01), None
patent: 1 129 861 (2001-09-01), None
patent: 1170123 (2002-01-01), None
Bolli Angelo
Tettamanti Andrea
Gilliam Barbara L.
Jacobson & Holman PLLC
LASTRA S.p.A.
LandOfFree
Heat-sensitive composition in which removal of the unexposed... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-sensitive composition in which removal of the unexposed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive composition in which removal of the unexposed... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3707818