Heat resistant positive resists and method for preparing heat-re

Details Heat resistant positive resists and method for preparing heat-re Heat resistant positive resists and method for preparing heat-re

1988-05-09

1989-07-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 156904, 427 431, 430283, 430296, 430323, 430955, B44C 122, B05D 306, G03C 168, G03C 500

Patent

active

048490512

ABSTRACT:
The invention provides heat-resistant positive resists and methods for preparing heat-resistant relief structures therefrom. The positive resists are based upon polybenzoxazole precursor stages and diazoquinones. The polybenzoxazole precursor stages are hydroxypolyamides with the following structure: ##STR1## where R, R*, R.sub.1 and R.sub.1 * are aromatic groups; n.sub.1 and n.sub.2 =1 to 100; and R.noteq.R* and/or R.sub.1 .noteq.R.sub.1 *.

REFERENCES:
patent: Re30186 (1980-01-01), Rubner et al.
patent: 2904537 (1959-09-01), Brinker et al.
patent: 3332907 (1967-07-01), Angelo et al.
patent: 3644288 (1972-02-01), Odier et al.
patent: 3852239 (1974-12-01), Bellmann et al.
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4339521 (1982-07-01), Ahne et al.
patent: 4395482 (1983-07-01), Ahne et al.
patent: 4415653 (1983-11-01), Lai et al.
patent: 4568601 (1986-02-01), Araps et al.

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