Heat-resistant photosensitive resin composition, method for...

Details Heat-resistant photosensitive resin composition, method for... Heat-resistant photosensitive resin composition, method for...

2011-04-26

2011-04-26

Chu, John S (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S014000, C430S191000, C430S192000, C430S193000, C430S326000, C430S330000, C430S906000

Reexamination Certificate

active

07932012

ABSTRACT:
A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.

REFERENCES:
patent: 4395482 (1983-07-01), Ahne et al.
patent: 5756254 (1998-05-01), Kihara et al.
patent: 6071670 (2000-06-01), Ushirogouchi et al.
patent: 6727049 (2004-04-01), Thackeray et al.
patent: 6899989 (2005-05-01), Suzuki et al.
patent: 6929891 (2005-08-01), Rushkin et al.
patent: 7060413 (2006-06-01), Thackeray et al.
patent: 2002/0090569 (2002-07-01), Suzuki et al.
patent: 2003/0203310 (2003-10-01), Thackeray et al.
patent: 54-109828 (1979-08-01), None
patent: 60-135935 (1985-07-01), None
patent: 62-127840 (1987-06-01), None
patent: 62-215264 (1987-09-01), None
patent: 11-223940 (1999-08-01), None
patent: 2000-199957 (2000-07-01), None
patent: 2000-305268 (2000-11-01), None
patent: 2001-49119 (2001-02-01), None
patent: 2001-181249 (2001-07-01), None
patent: 2003-026919 (2003-01-01), None
patent: 2003-255535 (2003-09-01), None
patent: 2003-330167 (2003-11-01), None
Japanese Official Action issued Sep. 2, 2008, in Application No. 2003-054299.

Affiliated with

Also associated with

Rating

Heat-resistant photosensitive resin composition, method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-resistant photosensitive resin composition, method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-resistant photosensitive resin composition, method for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2714204