Heat-resistant photosensitive resin composition

Details Heat-resistant photosensitive resin composition Heat-resistant photosensitive resin composition

1987-04-14

1988-11-22

Michl, Paul R.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430286, 430287, 522101, 522102, 522103, 522 33, 522 46, 522 49, 522 43, 522 68, G03C 168, G03C 516

Patent

active

047865792

ABSTRACT:
The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion.

REFERENCES:
patent: 4025348 (1977-05-01), Tsukada et al.
patent: 4390615 (1983-06-01), Courtney et al.
patent: 4479983 (1984-10-01), Appelt et al.

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