Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1988-02-23
1991-02-26
McCamish, Marion C.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430287, 430288, 430280, 430281, 522102, 522103, 522110, 522112, 522 46, 522 48, G03F 7031
Patent
active
049961322
ABSTRACT:
The photosensitive resin composition comprises (a) a ternary copolymer of an ethylenically unsaturated amide, carboxyl-containing monomer and third monomer, (b) an esterified resin by the reaction of an unsaturated carboxylic acid and a novolactype epoxy resin, (c) a photopolymerizable monomer, (d) a photopolymerization initiator and (e) a powder such as a finely divided silica filler. The resist layer formed from the composition is capable of being developed with an alkaline aqueous solution and has excellent heat resistance in addition to other desirable properties when the patterned resist layer by the pattern-wise exposure to ultraviolet light and development is subjected to a heat treatment to effect thermal curing.
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Horigome Tomoki
Iwata Akira
Tazawa Kenji
Tohda Hiroyuki
McCamish Marion C.
Rodee Christopher D.
Toyko Ohka Kogyo Co. Ltd.
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